This year's European Electronics Assembly Reliability Summit, being held September 21-23 in Tallinn, Estonia, provides a unique opportunity to examine, learn and debate business-critical reliability, traceabilityand yield enhancement issues.

Online registration is also now open.

Conference

The two-day conference programme, being held September 22nd & 23rd, features 24 high-profile speakers from all over the world. The conference is broken down into plenary sessions, plus four parallel tracks: Process, Test, Materials andAssembly. The full conference schedule and session abstracts can be accessed on the event's website. Here's a listing of the sessions:

Plenary Sessions

• Pb-Free Soldering Processes—Survival, Quality, Reliability: Problems & Solutions 
  Werner Engelmaier, Engelmaier Associates LLC
• Reliability – The Bedrock of a Sustainable Electronics Industry
  Joe Fjelstad, Verdant Technologies
• Reliability Issues for New Technologies
  Marc Chason, Marc Chason & Associates Inc
• SMT Printing Solutions for Heterogeneous Assembly
  Clive Ashmore, DEK Printing Machines Ltd
• Comparing available detector types for X-Ray inspection 
  David Bernard, Nordson DAGE
• Resource-efficient conformal coating in electronic assemblies 
  Alexandra Rost, Zestron GmbH

Process Track

• Jet Printing
  Malin Siberg, MYDATA Automation AB
• How Clean Is Clean?
  Sheila Hamilton, Teknek Ltd
• Speed, Repeatability, Quality, and Traceability; does this work together well? (abstract available soon)
  (Speaker to be announced), EKRA
• The effect of mixing BGA and solder paste alloys on the formation of voids
  Alan Plant, Cookson Electronics
• Reliable wave and selective soldering means observing materials' solder heat resistance
  Juergen Friedrich, ERSA

Materials Track

• UV-ACA-Adesives – electrically conductive Hightech-Adesives(abstract available soon)
  Achim Battermann, Panacol-Elosol
• Reliable encapsulants for microelectronics
  Harald Neumeier, DELO Industrial Adhesives
• Solder Paste Attributes for Maximizing the Print & Reflow Process Windows
  Karthik Vijayamadhaven, Indium Corporation
• Influence of micro alloying additions on metallurgical properties of lead free alloys
  Gerjan Diepstraten, Cobar Europe BV – Balver Zinn
• Evaluation and test strategies for conformal coatings and solder pastes and processes 
  Dr. Manfred Suppa, Lackwerke Peters GmbH + Co KG

Test Track

• FlyScan and flying probe platform 
  Sergio Vigno, Seica SpA
• Reliability Evaluation of Printed Wire Boards Using Interconnected Stress Test (IST) 
  Paul Reid, PWB Interconnect Solutions
• How to ensure reliability within the product life cycle – focus on production processes 
  Dr. Viktor Tiederle, RELNETyX AG
• Compared statistic capabilities of dispensing solder paste with various dispensing methods 
  Philippe Mysson, EFD INTERNATIONAL INC.

Assembly Track

• Choosing the Optimum Assembly Process (abstract available soon)
  Peter Grundy, PG Engineering Ltd/Kirsten Soldering AG
• Competitive Benefits of Build-to-Order in SMT Production
  Sebastian Weckel, Siemens Electronic Assembly Systems GmbH & Co KG
• SMT Yield Enhancement – Don't sweat the big stuff – small stuff maters….
  Alec Moffat, MVP-DPC
• Substrate integrity after depanelling
  (Speaker to be announced), ASYS

Online registration is now open.

Workshops

September 21st, the day before the conference, is a workshop day, with eleven reliability workshops from world-renowned experts on offer. Workshops are half day, unless otherwise noted.

• Flexible Circuit Technology – Structures, Materials, Design Practices and Manufacturing Processes
  Joe Fjelstad, Verdant Electronics
• Advanced Packaging Technologies and Future Interconnection Trends
  Joe Fjelstad, Verdant Electronics
• Enhance Quality by CIP Integrated Inspection
  Thomas Ahrens, Trainalytics GmbH
• Soldering reliability – understanding the metallurgy and application modeling 
  Thomas Ahrens, Trainalytics GmbH
• Gerber Data Analysis in Electronic Production, Gerber3 Seminar (full day)
  Jennifer Vincenz, The "LeiterplattenAkademie GmbH" (i.e. "PCB-Academy")
• Solder Joint Reliability—Part 1: Fundamentals in Solder Joint Reliability
  Werner Engelmaier, Engelmaier Associates
• Solder Joint Reliability-Part 2: Failure Mode and Root Cause Analyses (Fatigue, Brittle Fracture, ENIG)
  Werner Engelmaier, Engelmaier Associates
• Cleaning in Electronic Production—Basic Requirement for Long-term Reliability
  Alexandra Rost, ZESTRON Europe
• Conformal Coating (abstract available soon)
  Gerd Schulze, Nordson ASYMTEK
• Key Issue System Reliability, Evaluation along the Complete Supply Chain 
  Dr. Viktor Tiederle, Fa. Relnetyx AG
• Solder Paste Printing – Opening the Black Box for Continuous High Quality Printing (abstract available soon)
  Axel Lindloff, DEK Printing Machines

Online registration is now open.

Panel Discussion

A panel discussion will be held at the end of the second day (Wednesday, September 22nd). Full details will be available in later this month.

Tabletop Exhibition

The tabletop exhibition will include the following companies:

• Dage
• Balver Zinn
• EKRA/ASYS
• Cookson
• Indium
• DELO
• ...and more

Mark your calendars for this important learning and networking event, September 21st-23rd, in Tallinn. We hope to see you there.

Online registration is now open.

For more information, visit the Summit's website.

The European Electronics Assembly Reliability and Yield Enhancement Summit is organized by Global SMT & Packaging magazine, Trafalgar Publications Ltd., Unit 18, 2 Lansdowne Crescent, Bournemouth, Dorset, BH1 1SA United Kingdom